Game cube

This time we are looking on the crossword puzzle clue for: Game cube.
it’s A 9 letters crossword definition.
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Last seen on: –Daily Boston Globe Crossword Answers Sunday, March 26, 2023
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NY Times Crossword 25 Jun 19, Tuesday

Random information on the term “Game cube”:

Hon Hai Precision Industry Co., Ltd., trading as Foxconn Technology Group and better known as Foxconn, is a Taiwanese multinational electronics contract manufacturing company with its headquarters in Tucheng, New Taipei, Taiwan. Today, it is the world’s largest provider of electronics manufacturing services and the fourth-largest information technology company by revenue. The company is the largest private employer in Taiwan and one of the largest employers worldwide. Its founder and chairman is Terry Gou.

Foxconn manufactures electronic products for major American, Canadian, Chinese, Finnish and Japanese companies. Notable products manufactured by Foxconn include the BlackBerry, iPad, iPhone, iPod, Kindle, Nintendo 3DS, Nokia devices, Xiaomi devices, PlayStation 3, PlayStation 4, Wii U, Xbox 360, Xbox One, and the TR4 CPU socket on some motherboards. As of 2012, Foxconn factories manufactured an estimated 40% of all consumer electronics sold worldwide.

Game cube on Wikipedia

Random information on the term “DIE”:

A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: “dice”, “dies” and “die”. To simplify handling and integration onto a printed circuit board, most dice are packaged in various forms.

Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300mm. These wafers are then polished to a mirror finish before going through photolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go through wafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are then packaged and the completed integrated circuit is ready to be shipped.

DIE on Wikipedia